In a single phrase: SK Hynix has simply surpassed its rival Samsung. The world’s second-largest reminiscence chip maker has change into the primary firm to mass-produce triple-level cell NAND with 321 layers. The development ought to result in increased capability reminiscence at an reasonably priced worth.
SK Hynix just lately launched its new 1 terabit 4D NAND chips, setting a brand new report. The corporate is on a roll because it was additionally the primary to launch its 238-layer NAND lower than a yr in the past. Just like the earlier launch, the 321-layer development is important as a result of it may considerably improve storage density for client and enterprise SSDs.
Densely packed chips may result in extra reasonably priced SSDs with capacities exceeding 100TB. This class of NAND might be particularly helpful for AI information facilities, though different performance-hungry purposes that crave power-efficient storage must also profit.
SK Hynix used ingenious course of optimizations to pack greater than 300 layers right into a single piece of NAND. The corporate’s new “Three Plugs” expertise concurrently connects three vertical reminiscence layer channels by way of an optimized electrical bonding course of. The method is understood for its wonderful manufacturing effectivity and makes use of low-stress supplies with automated alignment correction.
Nevertheless, linking all these layers created stress and alignment points that SK Hynix needed to overcome. The corporate overcame this by creating new low-stress supplies and automated alignment correction to maintain all the things straight throughout manufacturing.
The brand new course of additionally pushed manufacturing effectivity by 59 % in comparison with the earlier era by reusing the identical platform as 238-layer NAND. These effectivity enhancements imply higher efficiency and decrease prices out there. The corporate claims that the brand new 321-layer chips have 12 % sooner information transfers, 13 % sooner studying, and greater than 10 % increased energy effectivity than 238-layer NAND.
SK Hynix plans to ship these new storage gadgets to clients within the first half of 2025. The factitious intelligence market is the preliminary goal, however ultra-high capability SSDs for gaming, media enhancing and storage platforms ought to observe quickly after. of information.
Samsung will not be taking this information calmly. The tech large is already engaged on a 400-layer NAND that can arrive in 2026. It hopes to have its vertical bonded NAND expertise prepared by 2030. facilitating even denser chips with over 1000 layers and SSDs doubtlessly exceeding 200TB. The Japanese Kioxia has comparable outcomes. plans.
